SAC305 (SAC305)
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Basic Properties
| Alloy Type | |
|---|---|
| Designation | SAC305 |
Similar Alloys
Description
A lead-free solder containing 96.5% tin, 3% silver, and 0.5% copper, the most common lead-free solder
| No physical properties data available |
| No mechanical properties data available |
| No thermal properties data available |
| No processing properties data available |
Applications
Surface mount technology, wave soldering, printed circuit boards, consumer electronics